Epilayer Transfer (ELT) Concept







Epilayer Transfer...

Epitaxial Layer Transfer (ELT) is a proprietary, wafer-scale processing technology that enables the monolithic integration of optical devices on foundry-processed semiconductor wafers. ELT resolves many packaging constraints associated with current optoelectronic component integration. Bandwidth-limiting parasitics are virtually eliminated, packaging costs are reduced, and yields are increased due to economies of scale. This elegantly simple technology answers industry's call for ever higher precision integration of LEDs, LASERs, and PDs with any application-specific component or circuit regardless of the material system. ELT is alignment-free and the resulting high-density component integration is limited only by conventional lithography. A manufacturable heterogeneous integration technology such as ELT is the future of high performance, cost-effective compound semiconductor components and sub-modules. We have demonstrated high-density integration of 7 micron to 200 micron optical detectors with Silicon and GaAs electrical circuits; however, ELT can affect the integration of a much broader assortment of opto-electronic components that have only been imagined. ELT is the enabling technology that offers OptoGration clients a cost-effective path to highly integrated OEICs with "system on a chip" functionality.

Some advantages of ELT include:

Integrate any EO device with any EO circuit

  • Reduced cost
  • Reduced footprint
  • Increased reliability
  • Increased functionality
  • Enhanced performance
  • Design flexibility
  • High yield
  • Low L/C
  • Not material system limited
  • No wire bonds
  • Scalable to small size
  • Lithography driven